سي ايم پي پالش ڪرڻ وارو رگڙيندڙ

CMP (Chemical Mechanical Planarization) polishing abrasive is a key material in the fields of semiconductor manufacturing, optical glass, integrated circuits, etc., and achieve nano-level surface flattening through the synergistic effect of chemical corrosion and mechanical grinding.

درخواست:

CMP polishing abrasives are crucial key materials in the field of integrated circuit manufacturing and can be used in integrated circuit ILD, semiconductor monocrystalline silicon wafers, semiconductor silicon carbide, integrated circuit shallow trench isolation (STI), integrated circuit polysilicon (Poly - Si), integrated circuit metals and metal barrier layers.

خدمتون جيڪي مهيا ڪري سگهجن ٿيون:

گراهڪ جي درخواست جي منظرنامي جو تجزيو، ملندڙ مواد، ٽيڪنيڪل مسئلا حل ڪرڻ.

ڪمپني جو پروفائيل

سيميڪس ليب ۾ 2 ليبارٽريون آهن، ماهرن جي هڪ ٽيم جنهن وٽ 20 سالن جو مادي تجربو آهي، آر اينڊ ڊي ۽ پيداوار، جانچ ۽ تصديق جي صلاحيتن سان.

Performance Indicators for Ultra-High Purity Series Products

مکيه ايپليڪيشن فيلڊز

ماحولياتي زنجير جي تصديق جي تصديق

Semixlab CMP polishing abrasives meet the semiconductor industry certification and have passed the ISO 14001/45001/9001 certification

عام درخواست جو عمل

Raw material → Abrasive Synthesis (Surface modification)→ Slurry Formulation (Filtration/PH adjustment)→ CMP polishing (EPD control)→ Post-Clean → Inspection (AFM/KLA)→ Data Feedback Optimization

Through process parameter optimization, Semixlab CMP polishing abrasive has achieved breakthrough progress in the field of domestic high-end semiconductor integrated circuit, gradually replaced imports in the semiconductor market, and has been successfully applied to the production and manufacturing of LCD, OLED and other display panels. If you need to obtain detailed technical white papers or arrange sample testing, please contact our technical support team.

Semixlab CMP polishing abrasive core advantages

a.Freely adjustable particle diameter and degree of particle aggregation;

b.Monodisperse particles with uniform particle size distribution;

c.Stable dispersion system;

d.Large-scale production capability with minimal batch-to-batch variation;

e.Highly stable, resistant to agglomeration and sedimentation.

Semixlab CMP polishing abrasive shops